Technical Lead Package Platform Engineer

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .

Position Summary

We are seeking a L ead Package Engineer to drive the development, qualification, and manufacturing of advanced FCBGA packages. This role will drive package development from concept through NPI, qualification, and high-volume manufacturing, with strong ownership of technical execution, supplier management, project management, and package-related customer quality issues.

The successful candidate will work closely with package design, Product Engineering, Program Management, Quality, Marketing, substrate suppliers, and assembly OSAT partners to deliver robust, manufacturable, and reliable package solutions.

Key Responsibilities

• Lead FCBGA package NPI development from concept and die netlist through package design, assembly development, qualification, and production release.

• Provide technical leadership in FCBGA assembly manufacturing processes and laminate substrate technologies.

• Manage technical execution with substrate suppliers and assembly OSAT partners, including schedule, quality, manufacturing readiness, yield improvement, and issue resolution.

• Lead technical project management activities, including project planning, milestone tracking, risk assessment and mitigation, issue escalation, and cross-functional execution.

• Collaborate with Package Design, Product Engineering, Program Management, Quality, Marketing, and other internal teams to ensure successful product development and launch.

• Lead package reliability assessment and qualification planning for FCBGA products, including large-body packages.

• Support system-level reliability assessment and risk mitigation for large-size FCBGA packages.

• Lead investigation and resolution of customer returns and field quality issues related to package assembly processes, materials, and workmanship quality.

• Drive root cause analysis, failure analysis, containment, corrective actions, and recurrence prevention in collaboration with internal teams, material suppliers, substrate suppliers, and OSAT partners.

• Support package and substrate warpage characterization, analysis, and improvement, including the impact of materials, package architecture, and assembly processes.

• Contribute technical expertise to advanced packaging technologies, including Co-Packaged Optics (CPO) and Near-Packaged Optics (NPO).

Required Qualifications

• Bachelor's degree or higher in a related field

• Minimum of 5 years of professional experience in electronic packaging fields.

• Strong experience in FCBGA assembly manufacturing processes and laminate substrate technologies.

• Proven NPI development experience for advanced flip-chip packages, from early package definition through qualification and production release.

• Experience with package implementation from die netlist to flip-chip package design and manufacturing.

• Demonstrated experience managing substrate suppliers and assembly OSAT partners.

• Strong technical project management skills, including schedule and milestone management, technical risk assessment, issue resolution, and cross-functional execution.

• Demonstrated ability to lead and collaborate across Product Engineering, Program Management, Quality, Marketing, Design, and external supplier teams.

• Experience managing and resolving customer returns and field quality issues related to semiconductor packaging, particularly package assembly processes, material quality, and supplier workmanship.

• Strong problem-solving skills with experience in root cause analysis, failure analysis, containment, corrective actions, and recurrence prevention.

Preferred Qualifications

• Experience with Cadence Allegro Package Designer (APD) or equivalent package design tools.

• Strong knowledge of FCBGA package reliability mechanisms, test methodologies, and qualification requirements.

• Experience developing and executing qualification plans for FCBGA packages.

• Experience with system-level reliability assessment of large-body FCBGA packages.

Additional Assets

• Subject-matter expertise in Co-Packaged Optics (CPO) and/or Near-Packaged Optics (NPO).

• Deep technical expertise in package and substrate warpage, including characterization, modeling, material interactions, and assembly process impacts.

Base salary range is $160,000 to $200,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.